Chair: Alessio Zappone, University of Cassino and Southern Lazio (alessio.zappone@unicas.it)

Vice-chairs: Mark Flanagan, University College Dublin (mark.flanagan@ieee.org)

                    Daniel B. da Costa, Federal University of Cearà (danielbcosta@ieee.org)

                    Qingqing Wu, University of Macau (qingqingwu@um.edu.mo)

Secretary: Alexios Aravanis, CentraleSupelec (alexios.aravanis@gmail.com)

ETC Liason chair: Marco Di Renzo, CNRS & Paris Saclay University (marco.direnzo@centralesupelec.fr)

Scope: Provide a research and networking platform for researchers to collaborate exchange ideas and promote initiatives on Reconfigurable Intelligent Surfaces for Signal Processing and communications.

Topics of Interest. 

– Signal processing for RIS-empowered wireless networks

– Radio resource allocation for RIS-empowered wireless networks

– Fundamental performance limits of RIS-empowered wireless networks

– Channel estimation for RIS-empowered wireless networks

– RIS sensing, computing, and communication

– Experimental results and testbed implementations of RIS

– Software-defined design and implementation of RIS-empowered wireless networks

– AI-inspired design of and management of RIS-empowered wireless networks

– Indoor/outdoor localization in wireless networks using RIS

– Distributed deployment and network planning of RIS-empowered wireless networks

– Integration of RISs with state-of-the-art wireless technologies (e.g., small cells, Massive MIMO, millimeter-wave communications, THz communication, free space optics, Internet of Things, drones-aided communications, energy harvesting, physical layer security techniques, etc.)

Future and ongoing activities.

– Workshop @ ICC 2021:“Reconfigurable Intelligent Surfaces for Future Wireless Communications”

– Special Issue @ Transactions on Cognitive Communications and Networking: “Wireless Networks Empowered by Reconfigurable Intelligent Surfaces”

– Tutorial: “Reconfigurable Intelligent Surfaces Surfaces for Future Wireless Communications”, by A. Zappone, M. Di Renzo, S. Jin, M. Debbah. Accepted for presentation @:

            – IEEE CCNC 2021

            – IEEE WCNC 2021

            – IEEE VTC Spring 2021         

            – IEEE ICASSP 2021

– Collaboration with the recently established IEEE Emerging Technology Initiative on Reconfigurable Intelligent Surfaces and the IEEE best readings on Reconfigurable Intelligent Surfaces